Semiconductor package coating equipment - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Coating equipment for MEMS and semiconductor packages

We provide optimal coating systems for various mounting processes, including cutting-edge MEMS and semiconductor packaging processes.

Supports a wide range of production technologies for wafer-level CSP, TAB, COF, etc. - Excellent in-plane uniformity, capable of forming thin films and thick films at levels from 50nm to 100μm. - Coating examples: precise coating on thin films, thick films, uneven surfaces, and through holes. - We also sell equipment and conduct experiments and contract testing, so we can make proposals tailored to your applications and environments. 【Non-Contact Coating Equipment】 This coater allows for non-contact bulk coating of circular substrates such as wafers and disks without wasting coating liquid. It can handle high-viscosity liquids and thick films, which are difficult to coat with spin coaters. 【Precision Spray Coating Equipment】 Easily achieves coating on various substrates using a spray method. Spray coating samples can be produced easily with minimal materials. It accommodates a wide variety of workpieces, materials, and processes, including uneven substrates, thick films, and organic materials.